Prime Minister Narendra Modi said it will be a “special day” in India’s efforts to become a hub for semiconductors.
Prime Minister Narendra Modi on Wednesday laid the foundation stone of three semiconductor projects worth about ₹1.25 lakh crore via video conferencing. He also addressed youth across the country on the occasion.
The foundation stone was laid for three crucial projects: the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facilities at Morigaon in Assam, and Sanand in Gujarat.
“13th March 2024 – a special day in India’s efforts to become a hub for semiconductors. Tomorrow, will take part in the ‘India’s Techade: Chips for Viksit Bharat’ programme and lay the foundation stones for three semiconductor facilities worth over Rs. 1.25 lakh crore,” Modi said in a post on X.
“Among the highlights of the programme will be the participation of students from over 60,000 institutions. I would urge youngsters, and particularly those passionate about tech, to join tomorrow’s programme,” he added.
The projects are in line with the prime minister’s vision to position India as a prominent global centre for semiconductor design, manufacturing, and technology development, thereby creating numerous employment opportunities for the country’s youth, according to PMO.
The semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be established by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up semiconductor fabs in India. With an investment exceeding Rs. 91,000 crore, this will mark the inauguration of the country’s first commercial semiconductor fab.
